Electronic components are getting smaller while becoming more complex. Usual testing methods reach their limits here, when it is a matter of 100%-control, which is quasi inevitable. With our optical testing methods, it is possible to measure even the smallest components contactless in all 3 dimensions.
Finally, we support the whole production process for electronic products with a fast, incorruptible camera-inspection-technique: from the production of every single component over its assembly on boards, the correct sheeting in housings, right up to the verification for later functionality and the inspection of the end products.
Relevant inspection tasks are for example:
- control of electronic components (chip control)
- board control
- AOIs for the board manufacture
- solder joint control
- coplanarity control
- 3D pin control of plug connectors